Enhanced thermal conductivity of polyamide‐66 composites with mesocarbon microbeads through simple melt blending
In this work, composite samples were fabricated through melt blending with mesocarbon microbeads (MCMBs) and polyamide‐66 (PA66). Noteworthily, the thermal conductivity (TC) of the composites reached 1.51 W/m K with 60 wt% MCMBs, and the mechanical properties and heat resistance of PA66/MCMB composi...
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Published in | Polymer engineering and science Vol. 62; no. 2; pp. 530 - 536 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Hoboken, USA
John Wiley & Sons, Inc
01.02.2022
Society of Plastics Engineers, Inc Blackwell Publishing Ltd |
Subjects | |
Online Access | Get full text |
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Summary: | In this work, composite samples were fabricated through melt blending with mesocarbon microbeads (MCMBs) and polyamide‐66 (PA66). Noteworthily, the thermal conductivity (TC) of the composites reached 1.51 W/m K with 60 wt% MCMBs, and the mechanical properties and heat resistance of PA66/MCMB composite were significantly improved. It was mainly due to the formation of heat transfer network at high filler content and their good dispersion in the matrix. The present work provided a new selection of thermally conductive fillers and expanded the application of MCMB in thermal management materials.
Schematic diagram of sample preparation process and heat transfer pathways changing with fillers content. |
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Bibliography: | Funding information National Key R&D Program of China, Grant/Award Number: 2017YFB0307503; National Natural Science Foundation of China, Grant/Award Numbers: 51873193, 51973060, 52173086, 81772317 |
ISSN: | 0032-3888 1548-2634 |
DOI: | 10.1002/pen.25865 |