Enhanced thermal conductivity of polyamide‐66 composites with mesocarbon microbeads through simple melt blending

• Published in: Polymer engineering and science Vol. 62; no. 2; pp. 530 - 536
• Main Authors: Wu, Bozhen, Yang, Yuhao, Li, Mingpei, Zhu, Kaiqi, Iqbal, Zoya, Li, Yulin
• Format: Journal Article
• Language: English
• Published: Hoboken, USA John Wiley & Sons, Inc 01.02.2022; Society of Plastics Engineers, Inc; Blackwell Publishing Ltd
• Subjects: Chemical research; Composite materials; composites; Fillers; Heat conductivity; Heat resistance; Heat transfer; Mechanical properties; Melt blending; microstructure; Nanoparticles; Polyamide resins; Polyamides; Polymer matrix composites; Thermal conductivity; Thermal management; Thermal properties; Thermal resistance; China
• ISSN: 0032-3888; 1548-2634
• DOI: 10.1002/pen.25865

In this work, composite samples were fabricated through melt blending with mesocarbon microbeads (MCMBs) and polyamide‐66 (PA66). Noteworthily, the thermal conductivity (TC) of the composites reached 1.51 W/m K with 60 wt% MCMBs, and the mechanical properties and heat resistance of PA66/MCMB composite were significantly improved. It was mainly due to the formation of heat transfer network at high filler content and their good dispersion in the matrix. The present work provided a new selection of thermally conductive fillers and expanded the application of MCMB in thermal management materials. Schematic diagram of sample preparation process and heat transfer pathways changing with fillers content.