Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors

• Published in: Micromachines (Basel) Vol. 13; no. 5; p. 738
• Main Authors: Wan, Yuanjie, Li, Zhiwei, Huang, Zile, Hu, Baofa, Lv, Wenlong, Zhang, Chunquan, San, Haisheng, Zhang, Shaoda
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 06.05.2022; MDPI
• Subjects: Aluminum; Ambient temperature; capacitive pressure sensors; Design; Electrodes; Finite element method; Glass substrates; MEMS; Microelectromechanical systems; Packaging design; Parallel plates; Pressure sensors; self-packaging; Sensors; Silicon; Si–glass bonding; Si–glass bonding; MEMS; capacitive pressure sensors; self-packaging

This paper reports a MEMS capacitive pressure sensor (CPS) based on the operating principle of touch mode. The CPS was designed and fabricated using wafer-level self-packaged MEMS processes. The variable capacitance sensing structure was vacuum-sealed in a cavity using the Si-glass anodic bonding te...