Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors

• Published in: Micromachines (Basel) Vol. 13; no. 5; p. 738
• Main Authors: Wan, Yuanjie, Li, Zhiwei, Huang, Zile, Hu, Baofa, Lv, Wenlong, Zhang, Chunquan, San, Haisheng, Zhang, Shaoda
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 06.05.2022; MDPI
• Subjects: Aluminum; Ambient temperature; capacitive pressure sensors; Design; Electrodes; Finite element method; Glass substrates; MEMS; Microelectromechanical systems; Packaging design; Parallel plates; Pressure sensors; self-packaging; Sensors; Silicon; Si–glass bonding; Si–glass bonding; MEMS; capacitive pressure sensors; self-packaging
• ISSN: 2072-666X; 2072-666X
• DOI: 10.3390/mi13050738

This paper reports a MEMS capacitive pressure sensor (CPS) based on the operating principle of touch mode. The CPS was designed and fabricated using wafer-level self-packaged MEMS processes. The variable capacitance sensing structure was vacuum-sealed in a cavity using the Si-glass anodic bonding technique, and the embedded Al feedthrough lines at the Si-glass interface were used to realize the electrical connections between the parallel plate electrodes and the electrode pads through Al vias. The optimal design of the CPS structure was performed to trade-off the performance and reliability using finite element simulation. The CPS based on a circular-shaped diaphragm with a radius of 2000 µm and a thickness of 40 µm exhibits good comprehensive performance with a sensitivity of 52.3 pF/MPa and a nonlinearity of 2.7%FS in the pressure range of 100-500 kPa when the ambient temperature is less than 50 °C.