Improving Etched Flatness by Micro Airflow Array Pressurization in ITO Glass Laser Machining

• Published in: Micromachines (Basel) Vol. 14; no. 3; p. 676
• Main Authors: Chen, Rong, Chen, Zhaojie, Xie, Jin
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 19.03.2023; MDPI
• Subjects: air bearing; Air flow; Analysis; Ceramics; Circuits; Etching; Flatness; Flow velocity; Gas bearings; Glass lasers; Glass substrates; Hydrochloric acid; Indium tin oxides; ITO glass; Laser arrays; Laser etching; Laser machining; Lasers; Machining; micro-airflow; Parameters; Porous materials; Pressure distribution; Pressurization; Uniform flow; Warpage; Workpieces; Yield strength; micro-airflow; ITO glass; flatness; air bearing; laser etching
• ISSN: 2072-666X; 2072-666X
• DOI: 10.3390/mi14030676

In laser etching of ITO glass, the warpage due to workpiece positioning causes breakpoint or deformation of micron-scale etching circuits. Based on traditional laser etching, a micro-airflow array pressurization is proposed by using a micro-flow air bearing through airflow positioning. The objective is to achieve high-precision laser etching by pressurized micro-deformation of ITO glass during positioning. First, the micro-air flow and pressurized micro-deformation were modelled in relation to the airflow pressure and etching gap in order to analyze the flatness variation behavior. Then, the surface flatness was investigated in relation to the airflow parameters and relative bearing location. Finally, the critical value of the pressurization parameter were calculated using a data-twin and were applied to industrial ITO glass etching. It is shown that the uniform flow pressure distribution and surface central micro-deformation were formed by positive airflow pressure in the airflow area. The airflow pressure and etching gap could promote surface flatness, while excessive values could result in excessive deformation. Under the micro flow pressure, the initial flatness of the workpiece was able to be compensated within the critical pressurization parameter. By controlling the micro flow stress, the micro-airflow array pressurization could reduce the flatness to 22 μm with stress of 10.7-12.6 Pa. In industrial production, the surface fine circuits can be laser etched with an optimized micro flow pressure, which solves the problems of local breaks or deformed circuits due to the conventional etching process and the structural layout.