Resolution and Kinetic Stability of a Chiral Supramolecular Assembly Made of Labile Components

Enough mechanical stiffness that the metal centers can no longer racemize is provided by the connection of four labile metal centers (AlIII, GaIII, InIII, FeIII) and six achiral bis‐catecholate ligands in a rigid tetrahedral assembly (see picture). The resolution and unprecedented kinetic stability...

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Published inAngewandte Chemie (International ed.) Vol. 40; no. 1; pp. 157 - 160
Main Authors Terpin, Andreas J., Ziegler, Marco, Johnson, Darren W., Raymond, Kenneth N.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag GmbH 05.01.2001
WILEY‐VCH Verlag GmbH
Subjects
chiral resolution
cluster compounds
host-guest chemistry
kinetic stability
supramolecular chemistry
cluster compounds
host-guest chemistry
kinetic stability
supramolecular chemistry
chiral resolution
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Summary:Enough mechanical stiffness that the metal centers can no longer racemize is provided by the connection of four labile metal centers (AlIII, GaIII, InIII, FeIII) and six achiral bis‐catecholate ligands in a rigid tetrahedral assembly (see picture). The resolution and unprecedented kinetic stability of such a chiral supramolecular assembly is reported here for the first time.
Bibliography:ArticleID:ANIE157
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Coordination Number Incommensurate Cluster Formation, Part 18. Financial support of this work was provided by NSF CHE‐9709621 and by NSF and NATO‐NSF exchange grants INT‐9603212 and SRG 951516, respectively. We thank the Alexander‐von‐Humboldt Foundation for a Fellowship to A.T., and a Humboldt Research Award for Senior U.S. Scientists to K.R., and the Miller Foundation for a fellowship to M.Z. The authors gratefully acknowledge the assistance of Dr. F. J. Hollander and Dr. D. L. Caulder in selecting and mounting a suitable single crystal, and Prof. Julie A. Leary, Dr. Ulla N. Andersen, and J. J. Miranda for measuring mass spectra. Part 17: M. Ziegler, J. J. Miranda, U. N. Andersen, D. W. Johnson, J. A. Leary, K. N. Raymond
Angew. Chem.
in press.
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ISSN:1433-7851
1521-3773
DOI:10.1002/1521-3773(20010105)40:1<157::AID-ANIE157>3.0.CO;2-4