Compliant electrostatic chuck based on hairy microstructure

• Published in: Smart materials and structures Vol. 22; no. 1; pp. 15019 - 1-6
• Main Authors: Saito, Shigeki, Soda, Fumiaki, Dhelika, Radon, Takahashi, Kunio, Takarada, Wataru, Kikutani, Takeshi
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.01.2013; Institute of Physics
• Subjects: Chucks; Clamps; Devices; Electrostatics; Exact sciences and technology; Fibers; General equipment and techniques; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Microstructure; Physics; Prototypes; Semiconductors; Servo and control equipment; robots; Prototype; Compliance; Attraction interaction; Chuck; Rough surfaces; Microstructure; Cantilever beam; Fibers; Electrostatic force
• ISSN: 0964-1726; 1361-665X
• DOI: 10.1088/0964-1726/22/1/015019

An electrostatic chuck (ESC) is a device used to clamp and transport flat-surfaced objects such as thin semiconductor wafers. Working by the principle of electrostatic force, its functionality is limited in handling objects with rough surfaces, as the attractive forces at work are significantly reduced. To improve this weak point, by employing 70 μm diameter polymer-based electrostatic inductive fibers with a conductive core, we develop a device prototype with an adhesional mechanism having a hairy microstructure with appropriate mechanical compliance. We theoretically and experimentally investigate how the prototype works, and how the fibers' mechanical compliance affects the performance of ESC.