Electrodeposition of Cu/Ni–P multilayers by a single bath technique

Cu/Ni–P multilayers, comprised of alternatively formed ‘nano-size’ sublayers of Cu and Ni–P, have been successfully produced from a single bath using modulated (i.e. periodic pulse control) current density. The chemical composition and the crystallinity of resultant deposits are influenced by the de...

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Bibliographic Details
Published inThin solid films Vol. 397; no. 1; pp. 83 - 89
Main Authors Miyake, Takeshi, Kume, Michiyuki, Yamaguchi, Koichi, Amalnerkar, Dinesh P, Minoura, Hideki
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 01.10.2001
Elsevier Science
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Summary:Cu/Ni–P multilayers, comprised of alternatively formed ‘nano-size’ sublayers of Cu and Ni–P, have been successfully produced from a single bath using modulated (i.e. periodic pulse control) current density. The chemical composition and the crystallinity of resultant deposits are influenced by the deposition current density. Transmission electron microscopy (TEM) examination of our multilayer sample clearly showed the formation of alternative sublayers of Cu and Ni–P (thickness ∼50 nm). Electrolysis at a cathodic current density of 5 A/dm 2 yields a poorly crystallized Ni–P sublayer, while that at 10 A/dm 2 gives a crystalline one. Thus it is possible to obtain Cu/Ni–P multilayers with different crystallinity in the Ni–P sublayer by simply changing the cathodic current density.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(01)01359-1