Characterisation of a PERCIVAL monolithic active pixel prototype using synchrotron radiation
PERCIVAL ("Pixelated Energy Resolving CMOS Imager, Versatile And Large") is a monolithic active pixel sensor (MAPS) based on CMOS technology. Is being developed by DESY, RAL/STFC, Elettra, DLS, and PAL to address the various requirements of detectors at synchrotron radiation sources and Fr...
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Published in | Journal of instrumentation Vol. 11; no. 2; p. C02090 |
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Main Authors | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
29.02.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PERCIVAL ("Pixelated Energy Resolving CMOS Imager, Versatile And Large") is a monolithic active pixel sensor (MAPS) based on CMOS technology. Is being developed by DESY, RAL/STFC, Elettra, DLS, and PAL to address the various requirements of detectors at synchrotron radiation sources and Free Electron Lasers (FELs) in the soft X-ray regime. These requirements include high frame rates and FELs base-rate compatibility, large dynamic range, single-photon counting capability with low probability of false positives, high quantum efficiency (QE), and (multi-)megapixel arrangements with good spatial resolution. Small-scale back-side-illuminated (BSI) prototype systems are undergoing detailed testing with X-rays and optical photons, in preparation of submission of a larger sensor. A first BSI processed prototype was tested in 2014 and a preliminary result-first detection of 350eV photons with some pixel types of PERCIVAL-reported at this meeting a year ago. Subsequent more detailed analysis revealed a very low QE and pointed to contamination as a possible cause. In the past year, BSI-processed chips on two more wafers were tested and their response to soft X-ray evaluated. We report here the improved charge collection efficiency (CCE) of different PERCIVAL pixel types for 400eV soft X-rays together with Airy patterns, response to a flat field, and noise performance for such a newly BSI-processed prototype sensor. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 1748-0221 1748-0221 |
DOI: | 10.1088/1748-0221/11/02/C02090 |