Topography and field effects in the inner side of microvia hole using ToF-SIMS

We have developed a simple and powerful method, which is called ‘angled sample holder method’, to characterize a topographic structured sample such as microsized via hole of ball grid array using time‐of‐flight SIMS. The diameter of via holes was 100 µm and the depth was 70 µm. To remove the shaded...

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Bibliographic Details
Published inSurface and interface analysis Vol. 46; no. 7; pp. 429 - 432
Main Authors Lee, Jae Cheol, Kyoung, Yong Koo, Song, In Yong, Lee, Jae Woo, Shin, Young Sik, Kim, Jin Seok, Iida, Shin-ichi
Format Journal Article
LanguageEnglish
Published Bognor Regis Blackwell Publishing Ltd 01.07.2014
Wiley Subscription Services, Inc
Subjects
angled sample holder
Arrays
Interface analysis
Ion beams
Sample holders
secondary ion trajectory
Simulation
Steering
ToF-SIMS
topographic structured sample
Topography
via hole
Walls
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Summary:We have developed a simple and powerful method, which is called ‘angled sample holder method’, to characterize a topographic structured sample such as microsized via hole of ball grid array using time‐of‐flight SIMS. The diameter of via holes was 100 µm and the depth was 70 µm. To remove the shaded area by incidence primary ion beam and to extract secondary ions from the bottom of a via hole, several types of angled sample holders with compensation steering plate were applied on the basis of simulation results using SIMION code. And the analyses using angled sample holder method enabled us to characterize the bottom and side wall of a via hole in clear. Copyright © 2014 John Wiley & Sons, Ltd.
Bibliography:ark:/67375/WNG-FVGDPN90-Z
ArticleID:SIA5569
istex:2CABFEAFD7753F698F0C400D3FEACD8127250AF6
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ObjectType-Article-1
ObjectType-Feature-2
ISSN:0142-2421
1096-9918
DOI:10.1002/sia.5569