TiN/STO/TiN MIMcaps nanolayers on silicon characterized by SIMS and AFM

High‐k dielectrics as SrxTi1‐xOy (STO) are of great interest for the development of dynamic random access memory devices. The characterization of these nanolayers is important. Secondary ion mass spectrometry (SIMS) depth profiling through TiN and STO films is affected by strong artifacts in differe...

Full description

Saved in:
Bibliographic Details
Published inSurface and interface analysis Vol. 45; no. 1; pp. 394 - 397
Main Authors Barozzi, M., Iacob, E., van den Berg, J.A., Reading, M.A., Adelmann, C., Popovici, M., Tielens, H, Bersani, M.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Chichester Blackwell Publishing Ltd 01.01.2013
Wiley
Wiley Subscription Services, Inc
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:High‐k dielectrics as SrxTi1‐xOy (STO) are of great interest for the development of dynamic random access memory devices. The characterization of these nanolayers is important. Secondary ion mass spectrometry (SIMS) depth profiling through TiN and STO films is affected by strong artifacts in different ways. The erosion process causes surface topography modifications both in the TiN/STO/TiN layer system and in the silicon substrate. Atomic force microscopy analyses have been carried out on pristine TiN and STO film surfaces and at various crater depths. Very different roughness evolutions are identified for TiN or STO films, within the SIMS craters sputtered with 500 eV Cs+ while using eucentric stage rotation. Copyright © 2012 John Wiley & Sons, Ltd.
Bibliography:istex:851E3B6232766448A655FE8E2348916D66412CE9
ark:/67375/WNG-35WMLJ5J-W
ArticleID:SIA5038
ISSN:0142-2421
1096-9918
DOI:10.1002/sia.5038