Facile Fabrication of High-performance Polyimide Nanocomposites with in situ Formed “Impurity-free” Dispersants

Polyimide/carbon black（PI/CB） nanocomposite films were fabricated via the direct ball-milling method with poly（amic acid）（PAA）, the precursor of PI, as an in situ formed impurity-free dispersant. FTIR and Raman spectral results reveal that, besides physical adsorption, chemical grafting of PAA chain...

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Bibliographic Details
Published inChinese journal of polymer science Vol. 34; no. 5; pp. 532 - 541
Main Authors Shen, Jing-jing, Zhang, Dong-ge, Liu, Xing, Tang, Yu-chang, Lin, Yu, Wu, Guo-zhang
Format Journal Article
LanguageEnglish
Published Beijing Chinese Chemical Society and Institute of Chemistry, CAS 01.04.2016
Subjects
Adhesion
Carbon black
Characterization and Evaluation of Materials
Chemistry
Chemistry and Materials Science
Condensed Matter Physics
Dispersants
Industrial Chemistry/Chemical Engineering
Milling (machining)
Nanocomposites
Particulate composites
Polyimide resins
Polymer Sciences
Surface chemistry
分散剂
制备
原位形成
杂质
炭黑分散
电气性能
纳米复合材料
聚酰亚胺
Mechanical properties
Polyimide
Nanocomposites
Electrical resistivity
Impurity-free
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Summary:Polyimide/carbon black（PI/CB） nanocomposite films were fabricated via the direct ball-milling method with poly（amic acid）（PAA）, the precursor of PI, as an in situ formed impurity-free dispersant. FTIR and Raman spectral results reveal that, besides physical adsorption, chemical grafting of PAA chains onto the CB surface occurs during the ball-milling process. Comparative studies show that introduction of various commercial dispersants improves the dispersion of CB. However, the mixtures exhibit poor reproducibility, unstable electrical properties, and decreased tensile strength; these issues may be attributed to interfacial pollution brought about by differences in the chemical structures of the dispersant and the matrix. The impurity-free dispersant is effective not only in ensuring the uniform dispersion of CB particles but also in enhancing filler-matrix interfacial adhesion. High-molecular weight PAA chains are effective reagents for impurity-free modification and can therefore be used to improve the electrical and mechanical properties of the resultant composite.
Bibliography:Polyimide/carbon black（PI/CB） nanocomposite films were fabricated via the direct ball-milling method with poly（amic acid）（PAA）, the precursor of PI, as an in situ formed impurity-free dispersant. FTIR and Raman spectral results reveal that, besides physical adsorption, chemical grafting of PAA chains onto the CB surface occurs during the ball-milling process. Comparative studies show that introduction of various commercial dispersants improves the dispersion of CB. However, the mixtures exhibit poor reproducibility, unstable electrical properties, and decreased tensile strength; these issues may be attributed to interfacial pollution brought about by differences in the chemical structures of the dispersant and the matrix. The impurity-free dispersant is effective not only in ensuring the uniform dispersion of CB particles but also in enhancing filler-matrix interfacial adhesion. High-molecular weight PAA chains are effective reagents for impurity-free modification and can therefore be used to improve the electrical and mechanical properties of the resultant composite.
resultant milling attributed interfacial impurity dispersed Dispersants Impurity-free filler chains
11-2015/O6
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0256-7679
1439-6203
DOI:10.1007/s10118-016-1771-y