Monolithic Integration of a Folded Dipole Antenna With a 24-GHz Receiver in SiGe HBT Technology
The integration of an on-chip folded dipole antenna with a monolithic 24-GHz receiver manufactured in a 0.8-mum SiGe HBT process is presented. A high-resistivity silicon substrate (1000 Omega ldr cm) is used for the implemented circuit to improve the efficiency of the integrated antenna. Crosstalk b...
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Published in | IEEE transactions on microwave theory and techniques Vol. 55; no. 7; pp. 1467 - 1475 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.07.2007
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | The integration of an on-chip folded dipole antenna with a monolithic 24-GHz receiver manufactured in a 0.8-mum SiGe HBT process is presented. A high-resistivity silicon substrate (1000 Omega ldr cm) is used for the implemented circuit to improve the efficiency of the integrated antenna. Crosstalk between the antenna and spiral inductors is analyzed and isolation techniques are described. The receiver, including the receive and an optional transmit antenna, requires a chip area of 4.5 mm 2 and provides 30-dB conversion gain at 24 GHz with a power consumption of 960 mW. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0018-9480 1557-9670 1557-9670 |
DOI: | 10.1109/TMTT.2007.900315 |