Monolithic Integration of a Folded Dipole Antenna With a 24-GHz Receiver in SiGe HBT Technology

The integration of an on-chip folded dipole antenna with a monolithic 24-GHz receiver manufactured in a 0.8-mum SiGe HBT process is presented. A high-resistivity silicon substrate (1000 Omega ldr cm) is used for the implemented circuit to improve the efficiency of the integrated antenna. Crosstalk b...

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Bibliographic Details
Published inIEEE transactions on microwave theory and techniques Vol. 55; no. 7; pp. 1467 - 1475
Main Authors Ojefors, E.., Sonmez, E.., Chartier, S., Lindberg, P.., Schick, C.., Rydberg, A.., Schumacher, H..
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.07.2007
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:The integration of an on-chip folded dipole antenna with a monolithic 24-GHz receiver manufactured in a 0.8-mum SiGe HBT process is presented. A high-resistivity silicon substrate (1000 Omega ldr cm) is used for the implemented circuit to improve the efficiency of the integrated antenna. Crosstalk between the antenna and spiral inductors is analyzed and isolation techniques are described. The receiver, including the receive and an optional transmit antenna, requires a chip area of 4.5 mm 2 and provides 30-dB conversion gain at 24 GHz with a power consumption of 960 mW.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9480
1557-9670
1557-9670
DOI:10.1109/TMTT.2007.900315