张耀辉, 黄. 张. 殷. 崔. 刘. 边. 杨. (2011). Indium bump array fabrication on small CMOS circuit for flip-chip bonding. Journal of semiconductors, 32(11), 148-151. https://doi.org/10.1088/1674-4926/32/11/115014
Chicago Style (17th ed.) Citation张耀辉, 黄寓洋 张宇翔 殷志珍 崔国新 刘惠春 边历峰 杨辉. "Indium Bump Array Fabrication on Small CMOS Circuit for Flip-chip Bonding." Journal of Semiconductors 32, no. 11 (2011): 148-151. https://doi.org/10.1088/1674-4926/32/11/115014.
MLA (9th ed.) Citation张耀辉, 黄寓洋 张宇翔 殷志珍 崔国新 刘惠春 边历峰 杨辉. "Indium Bump Array Fabrication on Small CMOS Circuit for Flip-chip Bonding." Journal of Semiconductors, vol. 32, no. 11, 2011, pp. 148-151, https://doi.org/10.1088/1674-4926/32/11/115014.
Warning: These citations may not always be 100% accurate.