Comparison of AlGaN/GaN MSM Varactor Diodes Based on HFET and MOSHFET Layer Structures

In this letter, the performance of AlGaN/GaN-based metal-semiconductor-metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10-nm-thick SiO 2 layer between the electrodes; in MOSHFET-based diodes, this layer is also used a...

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Bibliographic Details
Published inIEEE electron device letters Vol. 27; no. 12; pp. 945 - 947
Main Authors Marso, M., Fox, A., Heidelberger, G., Kordos, P., Luth, H.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.12.2006
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:In this letter, the performance of AlGaN/GaN-based metal-semiconductor-metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10-nm-thick SiO 2 layer between the electrodes; in MOSHFET-based diodes, this layer is also used as an insulator underneath the gate. Device fabrication uses standard HFET fabrication technology, allowing easy integration in monolithic microwave integrated circuits. Devices with different electrode geometry are characterized by direct current and by S-parameter measurements up to 50 GHz. The HFET-based varactors show capacitance ratios up to 14 and cutoff frequencies up to 74 GHz. The MOSHFET-based devices, on the other hand, show lower capacitance ratios and poorer stability because of the insulation layer between electrodes and semiconductor
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ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2006.886705