A review of reliability prediction methods for electronic devices
A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability prediction methodologies into some categories easy to understand. A set of selected methods, which are of relevance to many industries, the...
Saved in:
| Published in | Microelectronics and reliability Vol. 42; no. 8; pp. 1155 - 1162 |
|---|---|
| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
01.08.2002
|
| Online Access | Get full text |
Cover
Loading…
| Abstract | A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability prediction methodologies into some categories easy to understand. A set of selected methods, which are of relevance to many industries, the aerospace industry among others, are reviewed and the possibility they offer to address the stated objectives is assessed. Their respective advantages and shortcomings are the basis for the recommendation we make to use the methods in a combined fashion (simultaneously or successively) along the product development process. |
|---|---|
| AbstractList | A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability prediction methodologies into some categories easy to understand. A set of selected methods, which are of relevance to many industries, the aerospace industry among others, are reviewed and the possibility they offer to address the stated objectives is assessed. Their respective advantages and shortcomings are the basis for the recommendation we make to use the methods in a combined fashion (simultaneously or successively) along the product development process. A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability prediction methodologies into some categories easy to understand. A set of selected methods, which are of relevance to many industries, the aerospace industry among others, are reviewed and the possibility they offer to address the stated objectives is assessed. Their respective advantages and shortcomings are the basis for the recommendation we make to use the methods in a combined fashion (simultaneously or successively) along the product development process. copyright 2002 Elsevier Science Ltd. All rights reserved. |
| Author | Boullié, J Meslet, B Foucher, B Das, D |
| Author_xml | – sequence: 1 givenname: B surname: Foucher fullname: Foucher, B email: bruno.foucher@eads.net organization: EADS CCR, 12, rue Pasteur BP76, 92152 Suresnes Cedex, France – sequence: 2 givenname: J surname: Boullié fullname: Boullié, J organization: EADS CCR, 12, rue Pasteur BP76, 92152 Suresnes Cedex, France – sequence: 3 givenname: B surname: Meslet fullname: Meslet, B organization: CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20740, USA – sequence: 4 givenname: D surname: Das fullname: Das, D email: digudas@calce.umd.edu organization: CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20740, USA |
| BookMark | eNqFkE9LAzEQxYNUsK1-BCEn0cNqMrub7J6klPoHCh5U8BayySxGtpuabJV-e9NWvHqagXnvMe83IaPe90jIOWfXnHFx88wYiAwkLy4ZXDHGKpnBERnzSkJWF_xtRMZ_khMyifEjiSTjfExmMxrwy-E39W3aOqcb17lhS9cBrTOD8z1d4fDubaStDxQ7NEPwvTPUJp_BeEqOW91FPPudU_J6t3iZP2TLp_vH-WyZmaIUQ2aY1rLJobIg28Y2dd1wy8oGSiElN2DqphWikJBOUOmq1IUQVXoyz6tcljKfkotD7jr4zw3GQa1cNNh1uke_iQpSDAgJSVgehCb4GAO2ah3cSoet4kztgKk9MLWjoRioPTC1890efJhaJCRBReOwN4lDSKWV9e6fhB_k9HN5 |
| CitedBy_id | crossref_primary_10_1002_pip_3645 crossref_primary_10_3389_fenrg_2022_912710 crossref_primary_10_1049_iet_sen_2017_0053 crossref_primary_10_17531_ein_2020_2_17 crossref_primary_10_1109_TR_2019_2923761 crossref_primary_10_1016_j_microrel_2009_06_034 crossref_primary_10_1016_j_renene_2019_03_136 crossref_primary_10_1016_j_ress_2010_01_008 crossref_primary_10_1016_j_asej_2021_02_015 crossref_primary_10_1016_j_rser_2022_112127 crossref_primary_10_3923_itj_2009_1080_1083 crossref_primary_10_1016_j_microrel_2012_10_008 crossref_primary_10_3390_s21227683 crossref_primary_10_1080_02564602_2020_1843552 crossref_primary_10_1016_j_microrel_2015_11_023 crossref_primary_10_1016_j_ress_2016_07_024 crossref_primary_10_1007_s12555_020_0099_0 crossref_primary_10_1177_8756087919849459 crossref_primary_10_1109_TPEL_2015_2429557 crossref_primary_10_1016_j_renene_2020_06_142 crossref_primary_10_1007_s00366_009_0135_4 crossref_primary_10_1177_1748006X13492954 crossref_primary_10_1007_s13198_014_0301_y crossref_primary_10_4218_etrij_2018_0540 crossref_primary_10_1002_qre_1468 crossref_primary_10_1007_s10825_023_02122_9 crossref_primary_10_1016_j_microrel_2015_09_031 crossref_primary_10_2478_jok_2020_0047 crossref_primary_10_1007_s13198_011_0040_2 crossref_primary_10_7791_jspmee_3_225 crossref_primary_10_1109_TR_2005_863814 crossref_primary_10_1016_j_microrel_2015_03_003 crossref_primary_10_1016_j_ress_2024_110291 crossref_primary_10_1115_1_4045170 crossref_primary_10_1007_s12206_008_0212_4 crossref_primary_10_1007_s13198_015_0408_9 crossref_primary_10_1109_TDMR_2006_876570 crossref_primary_10_1016_j_microrel_2009_12_008 crossref_primary_10_1177_1748006X15580837 crossref_primary_10_1016_j_asoc_2022_109743 crossref_primary_10_1088_1757_899X_471_11_112034 crossref_primary_10_1109_TEPM_2010_2084092 crossref_primary_10_1007_s13198_013_0146_9 crossref_primary_10_1080_19439962_2012_761316 crossref_primary_10_1109_ACCESS_2020_2995602 crossref_primary_10_1016_j_ress_2021_108143 crossref_primary_10_1016_j_jlp_2019_04_004 crossref_primary_10_3390_systems11120556 |
| Cites_doi | 10.1109/TR.1998.756084 10.1109/24.784270 10.1109/ECTC.2001.927756 10.1016/S0026-2714(97)00084-X 10.1109/24.126662 10.1109/24.722270 10.1109/96.618221 10.1002/qre.4680060407 10.1109/33.206943 |
| ContentType | Journal Article |
| Copyright | 2002 Elsevier Science Ltd |
| Copyright_xml | – notice: 2002 Elsevier Science Ltd |
| DBID | AAYXX CITATION 7SP 8FD L7M |
| DOI | 10.1016/S0026-2714(02)00087-2 |
| DatabaseName | CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace |
| DatabaseTitle | CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
| DatabaseTitleList | Technology Research Database |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 1872-941X |
| EndPage | 1162 |
| ExternalDocumentID | 10_1016_S0026_2714_02_00087_2 S0026271402000872 |
| GroupedDBID | --K --M .DC .~1 0R~ 123 1B1 1~. 1~5 29M 4.4 457 4G. 5VS 7-5 71M 8P~ 9JN AABNK AABXZ AACTN AAEDT AAEDW AAEPC AAIAV AAIKJ AAKOC AALRI AAOAW AAQFI AAQXK AAXUO AAYFN ABBOA ABFNM ABFRF ABJNI ABMAC ABXDB ABXRA ABYKQ ACDAQ ACGFS ACNNM ACRLP ACZNC ADBBV ADEZE ADJOM ADMUD ADTZH AEBSH AECPX AEFWE AEKER AENEX AEZYN AFKWA AFRZQ AFTJW AGHFR AGUBO AGYEJ AHHHB AHJVU AHZHX AIALX AIEXJ AIKHN AITUG AJBFU AJOXV ALMA_UNASSIGNED_HOLDINGS AMFUW AMRAJ AOUOD AXJTR AZFZN BJAXD BKOJK BLXMC CS3 DU5 EBS EFJIC EFLBG EJD EO8 EO9 EP2 EP3 F5P FDB FEDTE FGOYB FIRID FNPLU FYGXN G-2 G-Q GBLVA GBOLZ HVGLF HZ~ IHE J1W JJJVA KOM LY7 M41 MAGPM MO0 N9A O-L O9- OAUVE OZT P-8 P-9 P2P PC. Q38 R2- RIG RNS ROL RPZ RXW SDF SDG SES SET SEW SPC SPCBC SPD SSM SST SSV SSZ T5K T9H TAE UHS UNMZH WUQ XOL ZMT ~G- AAXKI AAYXX AFJKZ AKRWK CITATION 7SP 8FD L7M |
| ID | FETCH-LOGICAL-c456t-c0aa7b328d27fbdb99b1d05b256771c2c9bf66472db928a85a466870133837573 |
| IEDL.DBID | AIKHN |
| ISSN | 0026-2714 |
| IngestDate | Sat Oct 05 06:23:39 EDT 2024 Thu Sep 26 19:30:48 EDT 2024 Fri Feb 23 02:25:22 EST 2024 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 8 |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c456t-c0aa7b328d27fbdb99b1d05b256771c2c9bf66472db928a85a466870133837573 |
| Notes | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
| PQID | 27712672 |
| PQPubID | 23500 |
| PageCount | 8 |
| ParticipantIDs | proquest_miscellaneous_27712672 crossref_primary_10_1016_S0026_2714_02_00087_2 elsevier_sciencedirect_doi_10_1016_S0026_2714_02_00087_2 |
| PublicationCentury | 2000 |
| PublicationDate | 2002-08-01 |
| PublicationDateYYYYMMDD | 2002-08-01 |
| PublicationDate_xml | – month: 08 year: 2002 text: 2002-08-01 day: 01 |
| PublicationDecade | 2000 |
| PublicationTitle | Microelectronics and reliability |
| PublicationYear | 2002 |
| Publisher | Elsevier Ltd |
| Publisher_xml | – name: Elsevier Ltd |
| References | Johnson, Gullo (BIB19) 2000 Bowles (BIB5) 1992; 41 Leonard (BIB6) 1988; 37 UTEC 80810. Modèle universel pour le calcul de la fiabilité prévisionnelle des composants, cartes et équipements électroniques––RDF2000, (projet du 11/01/00) Wong (BIB8) 1990; 6 Gullo (BIB18) 1999 United States Department of Defense, US Mil-Hdbk-217. Reliability Prediction of Electronic Equipment, version F, 1995 British Telecom, Handbook of Reliability Data, HDR-5, 1995 Internet website Pecht, Shukla, Kelkar, Pecht (BIB30) 1997; 20 Pecht, Ramappan (BIB27) 1992; 15 Last modified 11 August 1999 Wong (BIB9) 1993; 42 Denson (BIB1) 1998; 47 Denson W. A tutorial: PRISM. Reliab Analysis Center 1999;3rd quarter:1–6 Telcordia Technologies Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment, Issue 1, Telcordia Customer Service, Piscataway, N. J., May 2001 Leonard (BIB7) 1989; 4 Jones, Hayes (BIB29) 1999; 48 Pecht, Ramakrishnan (BIB3) 2000; 22 McCluskey P. Fatigue and intermetallic formation in lead free solder die attach. Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, paper #44592, 9–13 July 2001. p. 1–7 Centre National d'Etude des Télécommunications. Handbook of Reliability Data for Electronic Components RDF-93 English Issue, 1993 Nippon Telegraph and Telephone Corporation, Standard Reliability Table for Semiconductor Devices, 1985 Siemens AG, Siemens Company Standard SN29500, Version 6.0, Failure Rates of Electronic Components, Siemens Technical Liaison and Standardization, 9 November 1999 Last modified 16 February 2001 SAE G-11 Committee, Aerospace information report on reliability prediction methodologies for electronic equipment AIR5286, Electronic reliability prediction sub-committee, 31/01/98 Osterman, Stadterman (BIB24) 1999 Charpenel P et al. An other way to assess electronics part reliability. Microelectronics Reliability, Proceedings ESREF 1997;37(10/11):1449–1452 Sinnadurai, Shukla, Pecht (BIB4) 1998; 47 Charpenel, Cavernes, Casanovas (BIB23) 1999 McCluskey P. A web-based graduate course on the mechanical design of high temperature and high power electronics. Proceedings of the electronic component and technology conference, 30 May 2001. p. 397–400 Denson (BIB28) 1998; 47 10.1016/S0026-2714(02)00087-2_BIB21 10.1016/S0026-2714(02)00087-2_BIB22 10.1016/S0026-2714(02)00087-2_BIB20 Gullo (10.1016/S0026-2714(02)00087-2_BIB18) 1999 10.1016/S0026-2714(02)00087-2_BIB25 10.1016/S0026-2714(02)00087-2_BIB26 Johnson (10.1016/S0026-2714(02)00087-2_BIB19) 2000 Bowles (10.1016/S0026-2714(02)00087-2_BIB5) 1992; 41 Jones (10.1016/S0026-2714(02)00087-2_BIB29) 1999; 48 Wong (10.1016/S0026-2714(02)00087-2_BIB9) 1993; 42 Leonard (10.1016/S0026-2714(02)00087-2_BIB6) 1988; 37 Denson (10.1016/S0026-2714(02)00087-2_BIB28) 1998; 47 10.1016/S0026-2714(02)00087-2_BIB10 10.1016/S0026-2714(02)00087-2_BIB11 Sinnadurai (10.1016/S0026-2714(02)00087-2_BIB4) 1998; 47 Osterman (10.1016/S0026-2714(02)00087-2_BIB24) 1999 10.1016/S0026-2714(02)00087-2_BIB2 10.1016/S0026-2714(02)00087-2_BIB16 10.1016/S0026-2714(02)00087-2_BIB17 10.1016/S0026-2714(02)00087-2_BIB14 Pecht (10.1016/S0026-2714(02)00087-2_BIB3) 2000; 22 10.1016/S0026-2714(02)00087-2_BIB15 10.1016/S0026-2714(02)00087-2_BIB12 Pecht (10.1016/S0026-2714(02)00087-2_BIB27) 1992; 15 10.1016/S0026-2714(02)00087-2_BIB13 Denson (10.1016/S0026-2714(02)00087-2_BIB1) 1998; 47 Charpenel (10.1016/S0026-2714(02)00087-2_BIB23) 1999 Wong (10.1016/S0026-2714(02)00087-2_BIB8) 1990; 6 Pecht (10.1016/S0026-2714(02)00087-2_BIB30) 1997; 20 Leonard (10.1016/S0026-2714(02)00087-2_BIB7) 1989; 4 |
| References_xml | – volume: 47 start-page: 419 year: 1998 end-page: 424 ident: BIB1 article-title: Rebuttal to: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits publication-title: IEEE Trans. Reliab. contributor: fullname: Denson – start-page: 181 year: 2000 end-page: 187 ident: BIB19 article-title: Improvements in reliability assessment and prediction methodology publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Gullo – volume: 47 start-page: 321 year: 1998 end-page: 328 ident: BIB28 article-title: The history of reliability prediction publication-title: IEEE Trans. Reliab. contributor: fullname: Denson – start-page: 269 year: 1999 end-page: 276 ident: BIB24 article-title: Failure assessment software for circuit card assemblies publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Stadterman – volume: 4 start-page: 1248 year: 1989 end-page: 1253 ident: BIB7 article-title: Failure prediction methodology calculations can mislead: use them wisely, not blindly publication-title: Proceedings of the National Aerospace and Electronics Conference NAECON contributor: fullname: Leonard – volume: 41 start-page: 2 year: 1992 end-page: 12 ident: BIB5 article-title: A survey of reliability prediction procedures for microelectronic devices publication-title: IEEE Trans. Reliab. contributor: fullname: Bowles – start-page: 365 year: 1999 end-page: 377 ident: BIB18 article-title: In-service reliability assessment and top-down approach provides alternative reliability prediction method publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Gullo – volume: 20 start-page: 229 year: 1997 end-page: 233 ident: BIB30 article-title: Criteria for the assessment of reliability models publication-title: IEEE Trans. Comp. Packag. Manufact. Technol. B contributor: fullname: Pecht – volume: 47 start-page: 110 year: 1998 end-page: 113 ident: BIB4 article-title: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits publication-title: IEEE Trans. Reliab. contributor: fullname: Pecht – volume: 48 start-page: 127 year: 1999 end-page: 134 ident: BIB29 article-title: A comparison of electronic reliability prediction models publication-title: IEEE Trans. Reliab. contributor: fullname: Hayes – volume: 6 start-page: 251 year: 1990 end-page: 257 ident: BIB8 article-title: What is wrong with the existing reliability prediction methods? publication-title: Qual. Reliab. Eng. Int. contributor: fullname: Wong – volume: 37 start-page: 450 year: 1988 end-page: 451 ident: BIB6 article-title: On US Mil-Hdbk-217 and reliability prediction publication-title: IEEE Trans. Reliab. contributor: fullname: Leonard – volume: 42 start-page: 261 year: 1993 ident: BIB9 article-title: A change in direction for reliability engineering is long overdue publication-title: IEEE Trans. Reliab. contributor: fullname: Wong – volume: 22 start-page: 699 year: 2000 end-page: 706 ident: BIB3 article-title: Development and activities of the IEEE reliability standards group publication-title: J. Reliab. Eng. Assoc. Jpn. contributor: fullname: Ramakrishnan – volume: 15 start-page: 1160 year: 1992 end-page: 1164 ident: BIB27 article-title: Are components still a major problem? A review of electronic systems and device field failure returns publication-title: IEEE Trans. Comp. Hybr. Manufact. Technol. contributor: fullname: Ramappan – start-page: 378 year: 1999 end-page: 382 ident: BIB23 article-title: A new prediction-methodology on avionics embedded electronics: why? how? publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Casanovas – volume: 47 start-page: 419 issue: 4 year: 1998 ident: 10.1016/S0026-2714(02)00087-2_BIB1 article-title: Rebuttal to: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits publication-title: IEEE Trans. Reliab. doi: 10.1109/TR.1998.756084 contributor: fullname: Denson – ident: 10.1016/S0026-2714(02)00087-2_BIB25 – start-page: 365 year: 1999 ident: 10.1016/S0026-2714(02)00087-2_BIB18 article-title: In-service reliability assessment and top-down approach provides alternative reliability prediction method publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Gullo – ident: 10.1016/S0026-2714(02)00087-2_BIB21 – ident: 10.1016/S0026-2714(02)00087-2_BIB2 – volume: 48 start-page: 127 issue: 2 year: 1999 ident: 10.1016/S0026-2714(02)00087-2_BIB29 article-title: A comparison of electronic reliability prediction models publication-title: IEEE Trans. Reliab. doi: 10.1109/24.784270 contributor: fullname: Jones – volume: 42 start-page: 261 year: 1993 ident: 10.1016/S0026-2714(02)00087-2_BIB9 article-title: A change in direction for reliability engineering is long overdue publication-title: IEEE Trans. Reliab. contributor: fullname: Wong – ident: 10.1016/S0026-2714(02)00087-2_BIB15 – ident: 10.1016/S0026-2714(02)00087-2_BIB17 – ident: 10.1016/S0026-2714(02)00087-2_BIB26 doi: 10.1109/ECTC.2001.927756 – ident: 10.1016/S0026-2714(02)00087-2_BIB13 – start-page: 378 year: 1999 ident: 10.1016/S0026-2714(02)00087-2_BIB23 article-title: A new prediction-methodology on avionics embedded electronics: why? how? publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Charpenel – ident: 10.1016/S0026-2714(02)00087-2_BIB11 – ident: 10.1016/S0026-2714(02)00087-2_BIB20 – ident: 10.1016/S0026-2714(02)00087-2_BIB22 doi: 10.1016/S0026-2714(97)00084-X – volume: 22 start-page: 699 issue: 8 year: 2000 ident: 10.1016/S0026-2714(02)00087-2_BIB3 article-title: Development and activities of the IEEE reliability standards group publication-title: J. Reliab. Eng. Assoc. Jpn. contributor: fullname: Pecht – volume: 37 start-page: 450 year: 1988 ident: 10.1016/S0026-2714(02)00087-2_BIB6 article-title: On US Mil-Hdbk-217 and reliability prediction publication-title: IEEE Trans. Reliab. contributor: fullname: Leonard – volume: 4 start-page: 1248 year: 1989 ident: 10.1016/S0026-2714(02)00087-2_BIB7 article-title: Failure prediction methodology calculations can mislead: use them wisely, not blindly publication-title: Proceedings of the National Aerospace and Electronics Conference NAECON contributor: fullname: Leonard – start-page: 269 year: 1999 ident: 10.1016/S0026-2714(02)00087-2_BIB24 article-title: Failure assessment software for circuit card assemblies publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Osterman – volume: 41 start-page: 2 issue: 1 year: 1992 ident: 10.1016/S0026-2714(02)00087-2_BIB5 article-title: A survey of reliability prediction procedures for microelectronic devices publication-title: IEEE Trans. Reliab. doi: 10.1109/24.126662 contributor: fullname: Bowles – start-page: 181 year: 2000 ident: 10.1016/S0026-2714(02)00087-2_BIB19 article-title: Improvements in reliability assessment and prediction methodology publication-title: Ann. Reliab. Maintain. Symp. Proc. contributor: fullname: Johnson – volume: 47 start-page: 110 issue: 2 year: 1998 ident: 10.1016/S0026-2714(02)00087-2_BIB4 article-title: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits publication-title: IEEE Trans. Reliab. doi: 10.1109/24.722270 contributor: fullname: Sinnadurai – ident: 10.1016/S0026-2714(02)00087-2_BIB14 – volume: 47 start-page: 321 issue: 3-SP year: 1998 ident: 10.1016/S0026-2714(02)00087-2_BIB28 article-title: The history of reliability prediction publication-title: IEEE Trans. Reliab. contributor: fullname: Denson – volume: 20 start-page: 229 issue: 3 year: 1997 ident: 10.1016/S0026-2714(02)00087-2_BIB30 article-title: Criteria for the assessment of reliability models publication-title: IEEE Trans. Comp. Packag. Manufact. Technol. B doi: 10.1109/96.618221 contributor: fullname: Pecht – ident: 10.1016/S0026-2714(02)00087-2_BIB16 – ident: 10.1016/S0026-2714(02)00087-2_BIB10 – ident: 10.1016/S0026-2714(02)00087-2_BIB12 – volume: 6 start-page: 251 issue: 4 year: 1990 ident: 10.1016/S0026-2714(02)00087-2_BIB8 article-title: What is wrong with the existing reliability prediction methods? publication-title: Qual. Reliab. Eng. Int. doi: 10.1002/qre.4680060407 contributor: fullname: Wong – volume: 15 start-page: 1160 issue: 6 year: 1992 ident: 10.1016/S0026-2714(02)00087-2_BIB27 article-title: Are components still a major problem? A review of electronic systems and device field failure returns publication-title: IEEE Trans. Comp. Hybr. Manufact. Technol. doi: 10.1109/33.206943 contributor: fullname: Pecht |
| SSID | ssj0007011 |
| Score | 2.029285 |
| Snippet | A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability... |
| SourceID | proquest crossref elsevier |
| SourceType | Aggregation Database Publisher |
| StartPage | 1155 |
| Title | A review of reliability prediction methods for electronic devices |
| URI | https://dx.doi.org/10.1016/S0026-2714(02)00087-2 https://search.proquest.com/docview/27712672 |
| Volume | 42 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV07T8MwED6VdoEB8RTlUTwwwJA2cRrbGaOKqoDoRKVulp2HVAmlVR8DC7-ds51QQEJIbJFjn6LPznd38j0AbrJURUzk6KaqKEUHRSMPanRWkAlzlqrUT6lJTn4es9Gk_ziNpg0Y1LkwJqyy4n7H6Zatq5FehWZvMZuZHF_KqKk3Z7JNBEcebqE6oqIJreThaTT-JGTuB65xHmWeWbBN5HFC7OCtT--sHI_-pqJ-kLXVQMMD2K9MR5K4rzuERl4ewd6XgoLHkCTE5aKQeYFPrzNXhfuNLJbmQsZsAnE9o1cErVWybYJDstxyxglMhvcvg5FXNUnwUrR91l7qK8V1SEVGeaEzHcc6yPxIoynDeYBIx7pgpkY8vqJCiUj1GcOf1PmmEQ9PoVnOy_wMSIGmgAqKfq7CGHWb0MiUprSjUKGgWRy3oVvjIheuFobcBokhkNIAKX0qLZCStkHU6MlvmyqRr_9ael2jLfHAm1sMVebzzQon8oAyTs__L_wCdm1TFxvHdwnN9XKTX6FtsdYd2Om-B53qBH0A1_nHAg |
| link.rule.ids | 315,783,787,4509,24128,27936,27937,45597,45691 |
| linkProvider | Elsevier |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1NS8MwGA5jHtSD-Inzazl40EO3Nm2T9DiGY-q20wa7haRNYSDd2MfBi7_dN0lLVRDBW0nTUJ4kT56XvB8I3WepjCnXYKbKOAUDRQEPKjBWgAk1TWXqp8QEJ48ndDiLXubxvIH6VSyMcassud9xumXrsqVbotldLRYmxpdQYvLNmWgTzoCH9yKjj2FRdz5qPw_mB65sHqGe6V6H8bghbOODTx7tKB757YD6QdX2_Bkco6NSOOKe-7cT1NDFKTr8kk7wDPV62EWi4GUOT28Ll4P7Ha_W5jrGTAF2FaM3GLQqrkvg4ExbxjhHs8HTtD_0yhIJXgrKZ-ulvpRMhYRnhOUqU0migsyPFQgZxgLAOVE5NRni4RXhkscyohS2qLNMYxZeoGaxLPQlwjkIARnkkZZhAicbV8CTJrEjlyEnWZK0UKfCRaxcJgxRu4gBkMIAKXwiLJCCtBCv0BPfplQAW__1abtCW8ByN3cYstDL3QY6soBQRq7-P3gb7Q-n45EYPU9er9GBLe9iPfpuUHO73ulbUBlbdWdX0SeUzcfb |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=A+review+of+reliability+prediction+methods+for+electronic+devices&rft.jtitle=Microelectronics+and+reliability&rft.au=Foucher%2C+B&rft.au=Boulli%C3%A9%2C+J&rft.au=Meslet%2C+B&rft.au=Das%2C+D&rft.date=2002-08-01&rft.pub=Elsevier+Ltd&rft.issn=0026-2714&rft.eissn=1872-941X&rft.volume=42&rft.issue=8&rft.spage=1155&rft.epage=1162&rft_id=info:doi/10.1016%2FS0026-2714%2802%2900087-2&rft.externalDocID=S0026271402000872 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0026-2714&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0026-2714&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0026-2714&client=summon |