Carbon nanotubes for interconnects in VLSI integrated circuits

The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmis...

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Published inPhysica Status Solidi (b) Vol. 245; no. 10; pp. 2303 - 2307
Main Authors Robertson, J., Zhong, G., Telg, H., Thomsen, C., Warner, J. M., Briggs, G. A. D., Detlaff, U., Roth, S., Dijon, J.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Berlin WILEY-VCH Verlag 01.10.2008
WILEY‐VCH Verlag
Wiley
Subjects
61.46.Fg
81.07.De
81.15.Gh
81.16.Hc
85.35.Kb
87.85.Rs
Applied sciences
Cross-disciplinary physics: materials science; rheology
Electronics
Exact sciences and technology
Materials
Materials science
Nanoscale materials and structures: fabrication and characterization
Nanotubes
Physics
Array
Transmission electron microscopy
VLSI
Integrated circuit interconnections
Carbon nanotubes
Chemical vapor deposition
Raman spectrum
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Summary:The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Bibliography:ArticleID:PSSB200879553
ark:/67375/WNG-S8NQ70F5-Q
EC project CANAPE
istex:CD9F9AFAB28272D4E58EE725AEE65BF3DDC881E7
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0370-1972
1521-3951
DOI:10.1002/pssb.200879553