Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures

• Published in: IEEE microwave and wireless components letters Vol. 19; no. 9; pp. 554 - 556
• Main Authors: De Paulis, F., Orlandi, A.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.09.2009; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Circuit properties; Design. Technologies. Operation analysis. Testing; Differential interconnects; Electric, optical and optoelectronic circuits; electromagnetic bandgap (EBG); Electromagnetic propagation; Electronics; Exact sciences and technology; Frequency; Integrated circuits; Materials; Metamaterials; Microstrip; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits; Microwaves; Periodic structures; Photonic band gap; Planar structures; Planes; power integrity; Resonance; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Signal analysis; Signal integrity; Signal transmission; Solids; Stripline; Striplines; Performance evaluation; Photonic band gap; Strip line; Current reference; electromagnetic bandgap (EBG); Differential interconnects; Transmission line; Photonic crystal; Interconnection; Integrated circuit; Signal processing; Signal transmission; Signal analysis; Signal integrity; power integrity; Planar technology
• ISSN: 1531-1309; 1558-1764
• DOI: 10.1109/LMWC.2009.2027062

The present contribution performs a systematic analysis of the impact of planar (or 2-D) EBG structures on the signal transmission performances of single ended and differential striplines that have the patterned plane of the EBG structure as a current reference.