The science and technology of magnetoresistive tunneling memory

Rapid advances in portable communication and computing systems are creating an increasing demand for nonvolatile random access memory that is both high-density and highspeed. Existing solid-state technologies are unable to provide all of the needed attributes in a single memory solution. Therefore,...

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Published inIEEE transactions on nanotechnology Vol. 1; no. 1; pp. 32 - 38
Main Authors Engel, B.N., Rizzo, N.D., Janesky, J., Slaughter, J.M., Dave, R., DeHerrera, M., Durlam, M., Tehrani, S.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.03.2002
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Rapid advances in portable communication and computing systems are creating an increasing demand for nonvolatile random access memory that is both high-density and highspeed. Existing solid-state technologies are unable to provide all of the needed attributes in a single memory solution. Therefore, a number of different memories are currently being used to achieve the multiple functionality requirements, often compromising performance and adding cost to the system. A new technology, magnetoresistive random access memory (MRAM) based on magnetoresistive tunneling, has the potential to replace these memories in various systems with a single, universal solution. The key attributes of MRAM are nonvolatility, high-speed operation. and unlimited read and write endurance. This technology is enabled by the ability to deposit high-quality, nanometer scale tunneling barriers that display enhanced magnetoresistive response. In this article we describe several fundamental technical and scientific aspects of MRAM with emphasis on recent accomplishments that enabled our successful demonstration of a 256-Kb memory chip.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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ISSN:1536-125X
1941-0085
DOI:10.1109/TNANO.2002.1005424