Design and analysis of a novel fine pitch and highly stretchable interconnect

• Published in: Microelectronics international Vol. 27; no. 1; pp. 33 - 38
• Main Authors: Hsu, Yung-Yu, Gonzalez, Mario, Bossuyt, Frederick, Axisa, Fabrice, Vanfleteren, Jan, Vandevelde, Bart, de Wolf, Ingrid
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 01.01.2010; MCB University Press
• Subjects: Applied sciences; Bonding; Copper; Deformation; Design. Technologies. Operation analysis. Testing; Elastomers; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Electronics industry; Exact sciences and technology; Films states of matter; Geometry; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; Materialdeforming processes; Materials science; Microelectronics; Physics; Scanning probe microscopes, components and techniques; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Statistical analysis; Studies; Deformation; Material-deforming processes; Films (states of matter); Bonding; Elastomers; Scanning electron microscopy; In situ; Finite element method; Interconnection; Integrated circuit; Stretchable structure; Delamination; Resistor; Damaging; Electromechanical properties

Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for "fine pitch" applications in stretchable electronics.Design methodology approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric...