Design and analysis of a novel fine pitch and highly stretchable interconnect

• Published in: Microelectronics international Vol. 27; no. 1; pp. 33 - 38
• Main Authors: Hsu, Yung-Yu, Gonzalez, Mario, Bossuyt, Frederick, Axisa, Fabrice, Vanfleteren, Jan, Vandevelde, Bart, de Wolf, Ingrid
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 01.01.2010; MCB University Press
• Subjects: Applied sciences; Bonding; Copper; Deformation; Design. Technologies. Operation analysis. Testing; Elastomers; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Electronics industry; Exact sciences and technology; Films states of matter; Geometry; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; Materialdeforming processes; Materials science; Microelectronics; Physics; Scanning probe microscopes, components and techniques; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Statistical analysis; Studies; Deformation; Material-deforming processes; Films (states of matter); Bonding; Elastomers; Scanning electron microscopy; In situ; Finite element method; Interconnection; Integrated circuit; Stretchable structure; Delamination; Resistor; Damaging; Electromechanical properties
• ISSN: 1356-5362; 1758-812X
• DOI: 10.1108/13565361011009504

Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for "fine pitch" applications in stretchable electronics.Design methodology approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home-built electromechanical measurement is carried out by the four-probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading.Findings - The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling, and strain localized at the crest of a zigzag structure.Originality value - In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.