A Computational Fluid Dynamic Study on Efficiency of a Wavy Microchannel/Heat Sink Containing Various Nanoparticles

• Published in: Micromachines (Basel) Vol. 12; no. 10; p. 1192
• Main Authors: Khetib, Yacine, Abo-Dief, Hala M., Alanazi, Abdullah K., Sajadi, S. Mohammad, Sharifpur, Mohsen, Meyer, Josua P.
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 30.09.2021; MDPI
• Subjects: Aluminum; Aluminum oxide; Boundary conditions; Computational fluid dynamics; Cooling; Copper oxides; Efficiency; Figure of merit; Fluid flow; Geometry; Heat conductivity; Heat sinks; Heat transfer; Investigations; Microchannels; nanofluid; Nanofluids; Nanoparticles; numerical study; Reynolds number; Software; Thermal resistance; Turbulence models; two-phase model; Velocity; Viscosity; wavy microchannel heat sink
• ISSN: 2072-666X; 2072-666X
• DOI: 10.3390/mi12101192

In this paper, a common and widely used micro-heat sink (H/S) was redesigned and simulated using computational fluid dynamics methods. This H/S has a large number of microchannels in which the walls are wavy (wavy microchannel heat sink: WMCHS). To improve cooling, two (Al2O3 and CuO) water-based nanofluids (NFs) were used as cooling fluids, and their performance was compared. For this purpose, studies were carried out at three Reynolds numbers (Re) of 500, 1000, and 1500 when the volume percent (φ) of the nanoparticles (NPs) was increased to 2%. The mixture two-phase (T-P) model was utilized to simulate the NFs. Results showed that using the designed WMCHS compared to the common H/S reduces the average and maximum temperatures (T-Max) up to 2 °C. Moreover, using the Al2O3 NF is more suitable in terms of WMCHS temperature uniformity as well as its thermal resistance compared to the CuO NF. Increasing the φ is desirable in terms of temperature, but it enhances the pumping power (PP). Besides, the Figure of Merit (FOM) was investigated, and it was found that the value is greater at a higher volume percentage.