A profile identification system for surface mount printed circuit board assembly

Reflow soldering using InfraRed (IR) and/or convection is a popular method used to attach surface mount components to the Printed Circuit Board (PCB). The quality of the solder joints produced by reflow soldering is a function of the temperature parameters set for the operation. Identifying the appr...

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Bibliographic Details
Published inComputers & industrial engineering Vol. 33; no. 1; pp. 377 - 380
Main Authors Su, Y.Y., Srihari, K., Emerson, C.R.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Seoul Elsevier Ltd 01.10.1997
Oxford Pergamon Press
New York, NY Pergamon Press Inc
Subjects
Applied sciences
Decision support systems
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Expert Systems
Knowledge Based Systems
Operations research
Printed Circuit Board Assembly
Printed circuit boards
Reflow Soldering
Studies
Surface Mount Technology
Surface Mount Technology
Expert Systems
Reflow Soldering
Knowledge Based Systems
Printed Circuit Board Assembly
Assembly line
Temperature
Surface mount technology
Expert system
Printed circuit board
Infrared radiation
Knowledge base
Reflow soldering
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Summary:Reflow soldering using InfraRed (IR) and/or convection is a popular method used to attach surface mount components to the Printed Circuit Board (PCB). The quality of the solder joints produced by reflow soldering is a function of the temperature parameters set for the operation. Identifying the appropriate thermal profile for an IR radiation/convection oven for a specific PCB assembly is a complex problem in which several variables and control parameters need to be considered. The complete understanding of the interrelationships among the various domain parameters is required to obtain high yields for the processes requiring heating (reflow soldering and/or curing) in the PCB assembly process. A knowledge based approach was used to design and implement a profile identification decision support system for the surface mount PCB assembly domain. This system can help a process engineer determine the thermal profile for reflow soldering and/or for the curing of adhesive and/or conformal coats.
Bibliography:SourceType-Scholarly Journals-2
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ObjectType-Conference Paper-1
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ISSN:0360-8352
1879-0550
DOI:10.1016/S0360-8352(97)00116-2