A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film

A novel solution‐stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution‐stamping process compared to silver and gold films fabricated from colloid...

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Published inAdvanced materials (Weinheim) Vol. 23; no. 46; pp. 5524 - 5528
Main Authors Lee, Hye Moon, Choi, Si-Young, Kim, Kyung Tae, Yun, Jung-Yeul, Jung, Dae Soo, Park, Seung Bin, Park, Jongwook
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag 08.12.2011
WILEY‐VCH Verlag
Subjects
Aluminum - chemistry
aluminum ink
Calcium Compounds - chemistry
conductive features
Electric Conductivity
electrodes
Ink
Oxides - chemistry
Polyethylene Terephthalates - chemistry
Sodium Hydroxide - chemistry
solution processes
Solutions
thin films
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Summary:A novel solution‐stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution‐stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light‐emitting diodes (OLEDs) are investigated.
Bibliography:ark:/67375/WNG-RWZ4FTJS-R
ArticleID:ADMA201102805
istex:EE43D0B2839CFE26BBBD17A558EC9244E82D2CA3
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.201102805