Microstructure and electrical properties of Ti–Si–C–Ag nanocomposite thin films

• Published in: Surface & coatings technology Vol. 201; no. 14; pp. 6465 - 6469
• Main Authors: Eklund, P., Joelsson, T., Ljungcrantz, H., Wilhelmsson, O., Czigány, Zs, Högberg, H., Hultman, L.
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 2007; Elsevier
• Subjects: Applied sciences; Chemistry; Cross-disciplinary physics: materials science; rheology; Electron microscopy; Exact sciences and technology; Kemi; Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; NATURAL SCIENCES; NATURVETENSKAP; Other topics in materials science; Physics; Production techniques; Resistivity; Silver; Sputtering; Surface treatment; TECHNOLOGY; TEKNIKVETENSKAP; Titanium carbide; X-ray diffraction; X-ray diffraction; Silver; Electron microscopy; Resistivity; Sputtering; Titanium carbide; Electrical conductivity; Electrical properties; Surface treatments; XRD; Thin films; Composite materials; Nanocomposites; Titanium carbides; Microstructure; Carbides
• ISSN: 0257-8972; 1879-3347; 1879-3347
• DOI: 10.1016/j.surfcoat.2006.12.016

Ti–Si–C–Ag nanocomposite coatings consisting of nanocrystalline TiC in an amorphous Si matrix with segregated Ag were deposited by dual magnetron sputtering from Ti 3SiC 2 and Ag targets. As evidenced by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy, for Ag contents below 10 at.%, the Ag forms ∼ 10 nm large crystallites that are homogeneously distributed in the films. For higher Ag contents, coalescence during growth results in the formation of > ∼ 100 nm Ag islands on the film surface. The electrical resistivity of the coatings was measured in a four-point-probe setup, and ranged from 340 μΩcm (for Ti–Si–C coatings without Ag) to 40 μΩcm (for high Ag content).