Enhancement of the Flatband Modulation of Ni-Silicided Gates on Hf-Based Dielectrics

For the first time, the effect of the poly-Si gate electrode deposition process on the electrical characteristics of Ni-based fully silicided/HfO 2 gate stacks is investigated. The flat- band voltage V fb of Ni 2 Si/HfO 2 (or Ni 3 Si/HfO 2 ) with a physical vapor deposited (PVD) Si electrode was fou...

Full description

Saved in:
Bibliographic Details
Published inIEEE transactions on electron devices Vol. 55; no. 8; pp. 2238 - 2245
Main Authors YANG, Jian-Jun, WANG, Xin-Peng, ZHU, Chun-Xiang, LI, Ming-Fu, YU, Hong-Yu, LOH, Wei-Yip, KWONG, Dim-Lee
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.08.2008
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:For the first time, the effect of the poly-Si gate electrode deposition process on the electrical characteristics of Ni-based fully silicided/HfO 2 gate stacks is investigated. The flat- band voltage V fb of Ni 2 Si/HfO 2 (or Ni 3 Si/HfO 2 ) with a physical vapor deposited (PVD) Si electrode was found to significantly shift to the positive direction by 0.27 V (or 0.15 V), compared to the case with a chemical vapor deposited (CVD) Si electrode. On the contrary, the V fb of NiSi/HfO 2 with a PVD Si electrode slightly shifts to the negative direction from that with a CVD Si electrode (~0.05 V). Further, La is incorporated into HfO 2 to enhance the V fb modulation of Ni X Si gates with a PVD Si gate to near the conduction band edge of Si (~4.0 eV). We believe that the V fb shift of Ni X Si/HfO 2 is attributed to the release of Fermi-level pinning at the interface between the Si gate electrode and HfO 2 , arising from the different Si electrode formation process.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2008.926581