A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)

• Published in: Sensors (Basel, Switzerland) Vol. 20; no. 17; p. 5013
• Main Authors: Liu, Haochen, Tinsley, Lawrence, Lam, Wayne, Addepalli, Sri, Liu, Xiaochen, Starr, Andrew, Zhao, Yifan
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 03.09.2020; MDPI
• Subjects: Clinical decision making; Computer simulation; Decision making; Defects; Electronic components; feature selection; Inspection; Investigations; Machine learning; Manufacturing; numerical simulation; Packaging; Physical properties; pulsed thermography; quantitative classification; Safety critical; Simulation; Supply chains; Thermography; unverified electronic components
• ISSN: 1424-8220; 1424-8220
• DOI: 10.3390/s20175013

Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume inspection. As a complement of the existing inspection capabilities, a pulsed thermography-based screening technique is proposed in this paper using a digital twin methodology. A FEM-based simulation unit is initially developed to simulate the internal structure of electronic components with deviations of multiple physical properties, informed by X-ray data, along with its thermal behaviour under exposure to instantaneous heat. A dedicated physical inspection unit is then integrated to verify the simulation unit and further improve the simulation by taking account of various uncertainties caused by equipment and samples. Principle component analysis is used for feature extraction, and then a set of machine learning-based classifiers are employed for quantitative classification. Evaluation results of 17 chips from different sources successfully demonstrate the effectiveness of the proposed technique.