Residual stress change by thermal annealing in amorphous Sm−Fe−B thin films

• Published in: Journal of magnetism and magnetic materials Vol. 239; no. 1; pp. 570 - 572
• Main Authors: Na, S.M., Suh, S.J., Kim, H.J., Lim, S.H.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 01.02.2002; Elsevier Science
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Exact sciences and technology; Giant magnetostriction; Magnetic properties and materials; Magnetoelastic anisotropy; Magnetomechanical and magnetoelectric effects, magnetostriction; Physics; Residual stress; Thermal annealing; Thin films; Thin films; Magnetoelastic anisotropy; Thermal annealing; Giant magnetostriction; Residual stress; Temperature dependence; Samarium alloys; Inorganic compounds; Magnetostriction; Transition element compounds; Residual stresses; Amorphous state; Rare earth compounds; Bending stress; Boron alloys; Compressive stress; Tensile stress; Mechanical stress; Thermal expansion coefficient; Bending; Stress effects; Thermal stresses; Iron base alloys; Magnetic properties
• ISSN: 0304-8853
• DOI: 10.1016/S0304-8853(01)00668-0

The change in the residual stress and its effect on mechanical bending and magnetic properties of sputtered amorphous Sm–Fe–B thin films are investigated as a function of annealing temperature. Two stress components of intrinsic compressive stress and tensile stress due to the difference of the thermal expansion coefficients between the substrate and thin film are used to explain the stress state in as-deposited thin films, and the annealing temperature dependence of residual stress, mechanical bending and magnetic properties.