Light-Cured Junction Formation and Broad-Band Imaging Application in Thermally Mismatched van der Waals Heterointerface

Van der Waals (vdW) heterostructures are mainly fabricated by a classic dry transfer procedure, but the interface quality is often subject to the vdW gap, residual strains, and defect species. The realization of interface fusion and repair holds significant implications for the modulation of multipl...

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Bibliographic Details
Published inMaterials Vol. 17; no. 16; p. 3988
Main Authors Cheng, Liyuan, Quan, Qinglin, Hu, Liang
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 11.08.2024
MDPI
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Summary:Van der Waals (vdW) heterostructures are mainly fabricated by a classic dry transfer procedure, but the interface quality is often subject to the vdW gap, residual strains, and defect species. The realization of interface fusion and repair holds significant implications for the modulation of multiple photoelectric conversion processes. In this work, we propose a thermally mismatched strategy to trigger broad-band and high-speed photodetection performance based on a type-I heterostructure composed of black phosphorus (BP) and FePS3 (FPS) nanoflakes. The BP acts as photothermal source to promote interface fusion when large optical power is adopted. The regulation of optical power enables the device from pyroelectric (PE) and/or alternating current photovoltaic (AC–PV) mode to a mixed photovoltaic (PV)/photothermoelectric (PTE)/PE mode. The fused heterostructure device presents an extended detection range (405~980 nm) for the FPS. The maximum responsivity and detectivity are 329.86 mA/W and 6.95 × 1010 Jones, respectively, and the corresponding external quantum efficiency (EQE) approaches ~100%. Thanks to these thermally-related photoelectric conversion mechanism, the response and decay time constants of device are as fast as 290 μs and 265 μs, respectively, superior to current all FPS-based photodetectors. The robust environmental durability also renders itself as a high-speed and broad-band imaging sensor.
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ISSN:1996-1944
1996-1944
DOI:10.3390/ma17163988