Substrate temperature calculation for pulsed bias arc ion plating

The main factors influencing substrate temperature such as ion bombardment, heat radiation, and heat conductivity are analyzed for Pulsed-Bias Arc Ion Plating (PBAIP). The wave profile of the pulsed bias voltage, varying from −1000 to 0 V, is basically rectangle. This characteristic periodic energy...

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Bibliographic Details
Published inSurface & coatings technology Vol. 194; no. 2; pp. 325 - 329
Main Authors Guoqiang, Lin, Xiao, Bai, Chuang, Dong, Lishi, Wen
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 01.05.2005
Elsevier
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Summary:The main factors influencing substrate temperature such as ion bombardment, heat radiation, and heat conductivity are analyzed for Pulsed-Bias Arc Ion Plating (PBAIP). The wave profile of the pulsed bias voltage, varying from −1000 to 0 V, is basically rectangle. This characteristic periodic energy input has an average energy density being equal to the product of that of the DC Arc Ion Plating (DCAIP) and the duty cycle in PBAIP. A temperature model based on energy conservation for the substrate temperature is thus established, which incorporates input ion power, heat radiation and heat conductivity. Experiments are also conducted to verify the calculation.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0257-8972
1879-3347
DOI:10.1016/j.surfcoat.2004.07.074