Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles

• Published in: Microelectronics and reliability Vol. 54; no. 9-10; pp. 1911 - 1915
• Main Authors: Wang, Y., Jones, S., Dai, A., Liu, G.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Kidlington Elsevier Ltd 01.09.2014; Elsevier
• Subjects: Applied sciences; Design. Technologies. Operation analysis. Testing; Electric power generation; Electric vehicles; Electrical engineering. Electrical power engineering; Electrical junctions; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Hybrid and electric vehicles; Hybrid vehicles; IGBT module; Insulated gate bipolar transistors; Integrated circuits; Liquid cooling; Modules; Other multijunction devices. Power transistors. Thyristors; Packaging; Power electronics, power supplies; Reliability; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Thermal resistance; Packaging; Liquid cooling; IGBT module; Reliability; Hybrid and electric vehicles; Cooling by liquid; Thermal grease; Thermal management (packaging); Insulated gate bipolar transistor; Hostile environment; Durability; Compact design; Power electronics; Electric vehicle; Power transistor; Learning; Electrical network; Thermal resistance; Cooling system; Heat sink
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2014.07.037

Insulated Gate Bipolar Transistor (IGBT) modules in power train system of Hybrid and Electric Vehicles (HEV/EV) are working in harsh environment and high reliability and long lifetime are required. In this work, reliability enhancement by integrated liquid cooling structure in HEV/EV IGBT module is investigated. The thermal resistance of junction to heat sink can be reduced more than 50% by direct liquid cooling as eliminating thermal grease layer, so both active and passive temperature swings decrease significantly which will enhance module reliability and lifetime. The lifetime of modules with conventional and integrated liquid cooling structures are estimated under mission of standard driving cycles. We found that lifetime is prolonged obviously by direct cooling pin–fin base plate, and the compact module also makes the application power system simple and reliable.