A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transforming the generic inductance and resistance extra...
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Published in | IEEE transactions on advanced packaging Vol. 27; no. 1; pp. 71 - 78 |
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Main Authors | , , , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Piscataway, NY
IEEE
01.02.2004
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transforming the generic inductance and resistance extraction problem into one of per-unit-length parameter extraction. This methodology has been embodied in a CAD tool that is now in production use by interconnect designers and complementary metal oxide semiconductor (CMOS) process technologists. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 1521-3323 1557-9980 |
DOI: | 10.1109/TADVP.2004.825478 |