Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

• Published in: International journal of minerals, metallurgy and materials Vol. 19; no. 4; pp. 364 - 371
• Main Authors: Chen, Hui, Jia, Cheng-chang, Li, Shang-jie, Jia, Xian, Yang, Xia
• Format: Journal Article
• Language: English
• Published: Beijing University of Science and Technology Beijing 01.04.2012; Springer Nature B.V; School of Materials Science and Engineering University of Science and Technology Beijing, Beijing, 100083, China%Shenzhen Haimingrun Industrial Co. Ltd, Shenzhen 518126, China
• Subjects: Amorphous alloys; Atomizing; BONDING; Bonding strength; Carbon; Ceramics; Characterization and Evaluation of Materials; Chemistry and Materials Science; Chromium; Composite materials; COMPOSITES; Copper; COPPER ALLOYS (40 TO 99.3 CU); Copper base alloys; Corrosion and Coatings; DIAMONDS; ELECTRICAL CONDUCTIVITY; Glass; Heat transfer; High temperature; INTERFACES; Materials Science; Metallic Materials; Natural Materials; Physical properties; Raman spectra; Surfaces and Interfaces; Thermal conductivity; Thin Films; Tribology; Wettability; WETTING; 制备; 复合材料; 导热系数; 界面粘接强度; 界面粘结; 金刚石; 铜合金; 高温高压技术; diamonds; metallic matrix composites; thermal conductivity; copper alloys; interfacial bonding
• ISSN: 1674-4799; 1869-103X
• DOI: 10.1007/s12613-012-0565-7

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.