A dissolution model of base metal in liquid brazing filler metal during high temperature brazing

Controlling the dissolution of the base metal in the liquid filler metal is very significant for both brazing and soldering processes, in particular for high temperature brazing. A model for quantitatively evaluating the dissolution thickness of base metal in liquid brazing filler metal is establish...

Full description

Saved in:
Bibliographic Details
Published inScripta materialia Vol. 50; no. 7; pp. 1003 - 1006
Main Authors Zhang, X.P, Shi, Y.W
Format Journal Article
LanguageEnglish
Published New York, NY Elsevier Ltd 01.04.2004
Elsevier Science
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Controlling the dissolution of the base metal in the liquid filler metal is very significant for both brazing and soldering processes, in particular for high temperature brazing. A model for quantitatively evaluating the dissolution thickness of base metal in liquid brazing filler metal is established, that produces consistent predictions with experiment.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2003.12.032