A dissolution model of base metal in liquid brazing filler metal during high temperature brazing
Controlling the dissolution of the base metal in the liquid filler metal is very significant for both brazing and soldering processes, in particular for high temperature brazing. A model for quantitatively evaluating the dissolution thickness of base metal in liquid brazing filler metal is establish...
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Published in | Scripta materialia Vol. 50; no. 7; pp. 1003 - 1006 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
New York, NY
Elsevier Ltd
01.04.2004
Elsevier Science |
Subjects | |
Online Access | Get full text |
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Summary: | Controlling the dissolution of the base metal in the liquid filler metal is very significant for both brazing and soldering processes, in particular for high temperature brazing. A model for quantitatively evaluating the dissolution thickness of base metal in liquid brazing filler metal is established, that produces consistent predictions with experiment. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 1359-6462 1872-8456 |
DOI: | 10.1016/j.scriptamat.2003.12.032 |