Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS...

Full description

Saved in:
Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 5; no. 9; pp. 1219 - 1229
Main Authors Rieutort-Louis, Warren S. A., Sanz-Robinson, Josue, Moy, Tiffany, Liechao Huang, Yingzhe Hu, Afsar, Yasmin, Sturm, James C., Verma, Naveen, Wagner, Sigurd
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.09.2015
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Backplanes
Capacitors
Circuits
CMOS
CMOS integrated circuits
Copper
Couplings
Electronics
Flexible electronics
Hybrid systems
Inductors
integration
Interconnections
Joining
Laminates
noncontact
Packaging
Substrates
systems
thin film
wireless
noncontact
integration
thin film
wireless
systems
Flexible electronics
Online AccessGet full text

Cover

More Information
Summary:An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2015.2448755