Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy

• Published in: International journal of fatigue Vol. 26; no. 8; pp. 865 - 872
• Main Authors: Pang, John H.L., Xiong, B.S., Low, T.H.
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 01.08.2004; Elsevier Science
• Subjects: Applied sciences; Brazing. Soldering; Exact sciences and technology; Fatigue; Frequency effect; Joining, thermal cutting: metallurgical aspects; Lead free; Low cycle fatigue; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Morrow; Sn–0.7Cu; Solder; Solder; Fatigue; Sn–0.7Cu; Lead free; Morrow; Frequency effect; Low cycle fatigue; Mechanical properties; Sn-0.7Cu; Soldering; Tin base alloys; Copper alloy
• ISSN: 0142-1123; 1879-3452
• DOI: 10.1016/j.ijfatigue.2003.12.004

In this paper, low cycle fatigue studies on 99.3Sn–0.7Cu lead free solder was evaluated over a range of test temperatures (298, 348 and 398 K) and frequencies (10 −3–1 Hz), tested at four values of total strain range (2, 3.5, 5 and 7.5%). The fatigue performance of lead free 99.3Sn–0.7Cu solder was compared to 63Sn–37Pb solder. The effects of temperature and frequency on the low cycle fatigue life were discussed and were presented in Coffin–Manson and Morrow model relationships. Frequency modified Coffin–Manson and Morrow models were proposed for predicting the effect of frequency on low cycle fatigue life of 99.3Sn–0.7Cu solder alloy.