Transient liquid phase bonding of titanium to aluminium nitride

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 495; no. 1; pp. 254 - 258
• Main Authors: Dezellus, O., Andrieux, J., Bosselet, F., Sacerdote-Peronnet, M., Baffie, T., Hodaj, F., Eustathopoulos, N., Viala, J.C.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 15.11.2008; Elsevier
• Subjects: Ag–Cu alloy; Applied sciences; Chemical Sciences; Exact sciences and technology; Experimental study; Interfacial reactivity; Isothermal solidification; Joining, thermal cutting: metallurgical aspects; Material chemistry; Metal to ceramic brazing; Metals. Metallurgy; Transient liquid phase bonding; Welding; Interfacial reactivity; Transient liquid phase bonding; Metal to ceramic brazing; Ag–Cu alloy; Experimental study; Isothermal solidification; Annealing; Semiconductor materials; Wetting; Transition element compounds; Aluminium nitride; Fusion welding; Heterogeneous nucleation; Ceramic metal sealing; Precipitate; Inorganic compound; Solidification; Ag-Cu alloy; Titanium; Interface reaction; Melting point
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2007.10.104

Titanium has been successfully joined to aluminium nitride AlN at a temperature as low as 795 °C, using Ag–Cu Cusil ® commercial braze alloy. While reactive wetting and spreading proceeds at the AlN/braze alloy interface, chemical interactions develop at the titanium side rendering possible isothermal solidification of the joint. The determining factor in the solidification process is the fast formation of TiCu 4 crystals by heterogeneous nucleation and growth in the liquid phase. As a consequence, the braze alloy is depleted in Cu and solid Ag precipitates. After annealing, the re-melting temperature of the resulting joint can be increased up to about 910 °C which is nearly 130 °C higher than the melting point of the starting braze alloy.