Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

• Published in: ETRI journal Vol. 33; no. 6; pp. 864 - 870
• Main Authors: Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae
• Format: Journal Article
• Language: English
• Published: 한국전자통신연구원 01.12.2011
• Subjects: fluxing resin; Hybrid Cu paste; isotropic conductive adhesive; solder wetting; 전자/정보통신공학
• ISSN: 1225-6463; 2233-7326
• DOI: 10.4218/etrij.11.0110.0520

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy‐dispersive X‐ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre‐existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.