Eddy Current Measurement for Planar Structures

Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic...

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Published inSensors (Basel, Switzerland) Vol. 22; no. 22; p. 8695
Main Authors Xia, Zihan, Huang, Ruochen, Chen, Ziqi, Yu, Kuohai, Zhang, Zhijie, Salas-Avila, Jorge Ricardo, Yin, Wuliang
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 10.11.2022
MDPI
Subjects
Algorithms
Analysis
Automotive engineering
Chemical engineering
Deeds
Eddy current testing
Eddy currents
electromagnetic induction
Electromagnetic properties
Electromagnetism
Finite element analysis
Geometry
Impedance measurement
Inverse problems
Magnetic fields
Measurement
Measuring instruments
Metal plates
Methods
Nondestructive testing
Numerical analysis
Numerical methods
Physical properties
planar structure
Planar structures
Review
Sensors
theoretical calculation
Thickness measurement
eddy current testing
electromagnetic induction
theoretical calculation
measurement
planar structure
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Summary:Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic properties, and defects of metallic planar structures based on electromagnetic principles. In this review, we summarize recent developments in EC computational models, systems, algorithms, and measurement approaches for planar structures. First, the computational models including analytical models, numerical methods, and plate property estimation algorithms are introduced. Subsequently, the impedance measurement system and probes are presented. In plate measurements, sensor signals are sensitive to probe lift-off, and various algorithms for reducing the lift-off effect are reviewed. These approaches can be used for measureing thickness and electromagnetic properties. Furthermore, defect detection for metallic plates is also discussed.
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ISSN:1424-8220
1424-8220
DOI:10.3390/s22228695