Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum...

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Published inNanomaterials (Basel, Switzerland) Vol. 13; no. 15; p. 2154
Main Authors Lee, Jooyoung, Yang, Wonyoung, Lee, Geunhyeong, Cho, Youngsung, Kim, Jooheon
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 25.07.2023
MDPI
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Summary:The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum nitride/reduced graphene oxide/poly(dimethylsiloxane) (AlN/rGO/PDMS) composite material is made with a 3D foam structure and focuses on reducing GO and forming foam via polyvinyl alcohol (PVA). We analyze the successful fabrication of hybrid fillers and composites using various methods. The fabricated composite with a 3D network filler foam achieves a through-plane thermal conductivity of 1.43 W/mK and achieves 752% higher thermal conductivity compared to pure PDMS, which is superior to composites without 3D foam. The continuous 3D filler structure via freeze-drying and annealing processes provides efficient thermal dissipation in the through-plane direction pathway, which is critical for enhancing thermal conductivity. Therefore, this work produces a polymer composite material with improved thermal conductivity through various processes.
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These authors contributed equally to this work.
ISSN:2079-4991
2079-4991
DOI:10.3390/nano13152154