Mechanical Loss Angle Measurement for Stressed thin Film Using Cantilever Ring-Down Method

• Published in: Materials research (São Carlos, São Paulo, Brazil) Vol. 21; no. suppl 2; p. 1
• Main Authors: Kuo, Ling-Chi, Pan, Huang-Wei, Huang, Shu-Yu, Chao, Shiuh
• Format: Journal Article
• Language: English; Portuguese
• Published: Sao Carlos Universidade Federal do Sao Carlos, Departamento de Engenharia de Materiais 01.01.2018; ABM, ABC, ABPol; Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)
• Subjects: ENGINEERING, CHEMICAL; Gravitational waves; laser interferometer gravitational waves detector; MATERIALS SCIENCE, MULTIDISCIPLINARY; mechanical loss angle; METALLURGY & METALLURGICAL ENGINEERING; mirror coatings; Organic chemistry; Plasma enhanced chemical vapor deposition; Silicon nitride; Silicon substrates; stressed thin film; Thermal noise; Thin films; laser interferometer gravitational waves detector; mechanical loss angle; mirror coatings; stressed thin film
• ISSN: 1516-1439; 1980-5373; 1980-5373
• DOI: 10.1590/1980-5373-mr-2017-0869

Mechanical loss of the coating materials, and hence thermal noise from the mirror coatings, is a limiting factor for the sensitivity of the laser interferometer gravitational waves detector at its most sensitive frequency range. Mechanical loss of the thin films are often measured using the cantilever ring-down method. But when the thin film is under stress, the regular ring-down method gives incorrect results. We report a method to obtain the mechanical loss of stressed thin film using the cantilever ring-down technique. A proof-of-concept example is given to demonstrate and verify our method. The method can also be applied to obtain the mechanical loss angle of a rough interface; an example showed that loss angle of the interface between silicon nitride film deposited by plasma enhanced chemical vapor deposition method and silicon substrate is highly frequency dependent.