Study on the properties of Sn–9Zn– xCr lead-free solder

The influences of different Cr content to lead (Sn)–Zn solder were investigated. Sn–9Zn– xCr shows finer and more uniform microstructure than Sn–9Zn. Thermal gravimetric analysis (TGA) and Auger electron spectroscopy (AES) results show that adding Cr significantly improves the oxidation resistance o...

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Bibliographic Details
Published inJournal of alloys and compounds Vol. 460; no. 1; pp. 478 - 484
Main Authors Chen, Xi, Hu, Anmin, Li, Ming, Mao, Dali
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 28.07.2008
Elsevier
Subjects
Applied sciences
Brazing. Soldering
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Mechanical properties
Metals. Metallurgy
Microstructure
Oxidation
Mechanical properties
Microstructure
Oxidation
Wetting
Thermogravimetry
Tensile property
Thickness
Thermal properties
Wettability
Oxidation resistance
Chromium
Lead free solder
Chemical composition
Melting point
Auger electron spectrometry
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Summary:The influences of different Cr content to lead (Sn)–Zn solder were investigated. Sn–9Zn– xCr shows finer and more uniform microstructure than Sn–9Zn. Thermal gravimetric analysis (TGA) and Auger electron spectroscopy (AES) results show that adding Cr significantly improves the oxidation resistance of Sn–9Zn solder, and reduces the thickness of oxidation film of Sn–9Zn– xCr solder. When Cr content is 0.1%, the Sn–9Zn–0.1Cr solder have the best oxidation resistance. In addition, the effect of Cr addition on the wettability, melting point and mechanical properties of Sn–9Zn solder was discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2007.05.087