Analysis of thin layers and interfaces in ITO/a-Si:H/c-Si heterojunction solar cell structures by secondary ion mass spectrometry
Secondary ion mass spectrometry (SIMS) analysis of In, O, Si, and H concentrations versus depth distributions in ITO(In-Sn-O)/(n,p)a-Si:H/(p,n)-Si and ITO/(p)-Si heterojunction (HJ) solar cell structures was performed. SIMS measurements show some peculiarities of the element profiles in the interfac...
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Published in | Thin solid films Vol. 511; no. Complete; pp. 93 - 97 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
26.07.2006
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Subjects | |
Online Access | Get full text |
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Summary: | Secondary ion mass spectrometry (SIMS) analysis of In, O, Si, and H concentrations versus depth distributions in ITO(In-Sn-O)/(n,p)a-Si:H/(p,n)-Si and ITO/(p)-Si heterojunction (HJ) solar cell structures was performed. SIMS measurements show some peculiarities of the element profiles in the interface of ITO/a-Si:H and a-Si:H/Si regions. These peculiarities can be attributed to the non-homogeneities (In-rich nanostructures, small dents or mounds) of the ITO layer. It is shown that the formation of In-rich nanostructures is more pronounced in case of ITO growth on a (p)a-Si:H/(n) Si substrate at 230 °C. SIMS profiles obtained from such non-homogeneous areas can show a penetration of In into the Si bulk, which is not a real distribution. A hydrogen redistribution from the a-Si:H layer into the neighboring ITO and Si layers in case of ITO/(n,p)a-Si:H/(p,n)-Si structures as well as hydrogen gettering to the ITO/(p)-Si interface was detected. It is concluded that the final heterojunction structure of ITO/(n,p)a-Si:H/(p,n)c-Si is rather complex and includes in addition to the individual ITO, a-Si:H and Si layers also intermediate ones with different composition. |
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Bibliography: | SourceType-Scholarly Journals-2 ObjectType-Feature-2 ObjectType-Conference Paper-1 content type line 23 SourceType-Conference Papers & Proceedings-1 ObjectType-Article-3 |
ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2005.12.007 |