Split variable-length input Huffman code with application to test data compression for embedded cores in SOCs

• Published in: International journal of electronics Vol. 96; no. 9; pp. 935 - 942
• Main Authors: Giri, Chandan, Mallikarjuna Rao, B., Chattopadhyay, Santanu
• Format: Journal Article
• Language: English
• Published: Abingdon Taylor & Francis 01.09.2009; Taylor & Francis LLC
• Subjects: Applied sciences; Circuit properties; Data compression; Design. Technologies. Operation analysis. Testing; Electric, optical and optoelectronic circuits; Electronic circuits; Electronics; Exact sciences and technology; Huffman coding; Integrated circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Signal convertors; system-on-chip test; test application time; test data compression; test data compression; Coding; Data compression; test application time; Integrated circuit; Decoding circuit; System on a chip; Huffman coding; system-on-chip test
• ISSN: 0020-7217; 1362-3060
• DOI: 10.1080/00207210902876461

In this article, a run length encoding-based test data compression technique has been addressed. The scheme performs Huffman coding on different parts of the test data file separately. It has been observed that up to a 6% improvement in compression ratio and a 29% improvement in test application time can be achieved sacrificing only about 6.5% of the decoder area. We have compared our results with the other contemporary works reported in the literature. It has been observed that for most of the cases, our scheme produces a better compression ratio and that the area requirements are much less.