GaN Ku-band low-noise amplifier design including RF life test
As well as largely exploited for microwave high‐power applications, aluminum gallium nitride (AlGaN)/GaN high electron mobility transistor (HEMT) technologies have demonstrated promising results for the design of low‐noise, high dynamic range, and highly robust amplifiers. In this manuscript, we des...
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Published in | International journal of numerical modelling Vol. 28; no. 6; pp. 717 - 731 |
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Main Authors | , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Bognor Regis
Blackwell Publishing Ltd
01.11.2015
Wiley Subscription Services, Inc |
Subjects | |
Online Access | Get full text |
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Summary: | As well as largely exploited for microwave high‐power applications, aluminum gallium nitride (AlGaN)/GaN high electron mobility transistor (HEMT) technologies have demonstrated promising results for the design of low‐noise, high dynamic range, and highly robust amplifiers. In this manuscript, we describe the design and characterization of a Ku‐band monolithic microwave integrated circuit low‐noise amplifier for telecom space applications, exploiting an industrial AlGaN/GaN 0.25‐µm HEMT on silicon carbide process. In the frequency band 12.75–14.8 GHz, the LNA features over 20 dB linear gain with a noise figure around 1.8 dB. Input and output return losses are nearly 10 dB. Power dissipation is 700 mW in linear operation. An innovative transistor model based on electromagnetic analyses and small‐signal and noise measurements has been developed to improve the predictions of the foundry model on source‐degenerated devices. A systematic radio frequency (RF) life stress test campaign performed on the designed low‐noise amplifier demonstrated a safe operating area of 15 dBm of overdrive input power. Copyright © 2015 John Wiley & Sons, Ltd. |
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Bibliography: | ark:/67375/WNG-223RZXZ1-R istex:5B404F273EB35B4304788CE6E1817CFC5C488962 ArticleID:JNM2066 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0894-3370 1099-1204 |
DOI: | 10.1002/jnm.2066 |