Trapped oxygen in the grain boundaries of ZnO polycrystalline thin films prepared by plasma-enhanced chemical vapor deposition

ZnO thin films were deposited on Si wafers and glass substrates using diethylzinc (Zn(C 2H 5) 2) and Ar/N 2O mixed gases by plasma-enhanced chemical vapor deposition (PECVD). The Zn:O ratio of the thin film was analyzed by Rutherford backscattering spectrometry (RBS). It was observed that the values...

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Bibliographic Details
Published inMaterials letters Vol. 41; no. 4; pp. 159 - 163
Main Authors Kim, Young-Jin, Kim, Hyeong-Joon
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.11.1999
Elsevier
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Summary:ZnO thin films were deposited on Si wafers and glass substrates using diethylzinc (Zn(C 2H 5) 2) and Ar/N 2O mixed gases by plasma-enhanced chemical vapor deposition (PECVD). The Zn:O ratio of the thin film was analyzed by Rutherford backscattering spectrometry (RBS). It was observed that the values were less than unity, which meant that excess oxygen existed in the films. It could be determined that this oxygen was located in the grain boundaries of the ZnO polycrystalline thin films from the results of RBS, cross-sectional TEM and the electrical properties by Hall measurement.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-577X
1873-4979
DOI:10.1016/S0167-577X(99)00124-X