Trapped oxygen in the grain boundaries of ZnO polycrystalline thin films prepared by plasma-enhanced chemical vapor deposition
ZnO thin films were deposited on Si wafers and glass substrates using diethylzinc (Zn(C 2H 5) 2) and Ar/N 2O mixed gases by plasma-enhanced chemical vapor deposition (PECVD). The Zn:O ratio of the thin film was analyzed by Rutherford backscattering spectrometry (RBS). It was observed that the values...
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Published in | Materials letters Vol. 41; no. 4; pp. 159 - 163 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.11.1999
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | ZnO thin films were deposited on Si wafers and glass substrates using diethylzinc (Zn(C
2H
5)
2) and Ar/N
2O mixed gases by plasma-enhanced chemical vapor deposition (PECVD). The Zn:O ratio of the thin film was analyzed by Rutherford backscattering spectrometry (RBS). It was observed that the values were less than unity, which meant that excess oxygen existed in the films. It could be determined that this oxygen was located in the grain boundaries of the ZnO polycrystalline thin films from the results of RBS, cross-sectional TEM and the electrical properties by Hall measurement. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0167-577X 1873-4979 |
DOI: | 10.1016/S0167-577X(99)00124-X |