A comparison of some imidazoles in the curing of epoxy resin
An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole,...
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| Published in | Journal of industrial and engineering chemistry (Seoul, Korea) Vol. 16; no. 4; pp. 556 - 559 |
|---|---|
| Main Authors | , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
01.07.2010
한국공업화학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1226-086X 1876-794X |
| DOI | 10.1016/j.jiec.2010.03.022 |
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| Abstract | An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180
°C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. |
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| AbstractList | An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole,and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 8C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. KCI Citation Count: 81 An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 °C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. |
| Author | Min, Ji Hye Kim, Sun Hee Ham, Young Rok Shin, Jae Sup Yang, Minhee Lee, Dong Ho Shin, Young Jae |
| Author_xml | – sequence: 1 givenname: Young Rok surname: Ham fullname: Ham, Young Rok organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea – sequence: 2 givenname: Sun Hee surname: Kim fullname: Kim, Sun Hee organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea – sequence: 3 givenname: Young Jae surname: Shin fullname: Shin, Young Jae organization: Department of Electrical and Computer Engineering, Texas A&M University, College Station, TX 77843, USA – sequence: 4 givenname: Dong Ho surname: Lee fullname: Lee, Dong Ho organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea – sequence: 5 givenname: Minhee surname: Yang fullname: Yang, Minhee organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea – sequence: 6 givenname: Ji Hye surname: Min fullname: Min, Ji Hye organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea – sequence: 7 givenname: Jae Sup surname: Shin fullname: Shin, Jae Sup email: jsshin@chungbuk.ac.kr organization: Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea |
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| SubjectTerms | Conduction Curing Differential scanning calorimetry Electronic equipment Epoxy resins Imidazole Polymers Reaction time 화학공학 |
| Title | A comparison of some imidazoles in the curing of epoxy resin |
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