A comparison of some imidazoles in the curing of epoxy resin

An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole,...

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Published inJournal of industrial and engineering chemistry (Seoul, Korea) Vol. 16; no. 4; pp. 556 - 559
Main Authors Ham, Young Rok, Kim, Sun Hee, Shin, Young Jae, Lee, Dong Ho, Yang, Minhee, Min, Ji Hye, Shin, Jae Sup
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.07.2010
한국공업화학회
Subjects
Conduction
Curing
Differential scanning calorimetry
Electronic equipment
Epoxy resins
Imidazole
Polymers
Reaction time
화학공학
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ISSN1226-086X
1876-794X
DOI10.1016/j.jiec.2010.03.022

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Summary:An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 °C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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http://www.cheric.org/article/835469
G704-000711.2010.16.4.009
ISSN:1226-086X
1876-794X
DOI:10.1016/j.jiec.2010.03.022