Fluidic heterogeneous microsystems assembly and packaging

• Published in: Journal of microelectromechanical systems Vol. 15; no. 4; pp. 864 - 870
• Main Authors: Wei Zheng, Jaehoon Chung, Jacobs, H.O.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.08.2006; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Assembly; Autonomous; Circuits; Cross-disciplinary physics: materials science; rheology; Devices; Electronics; Encapsulation; Exact sciences and technology; Fluidic microsystems; Heterogeneous integration; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Light emitting diodes; Materials science; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Methods of nanofabrication; Microelectronic fabrication (materials and surfaces technology); Microfluidics; Micromechanical devices and systems; Packaging; Physics; Precision engineering, watch making; Segments; Self assembly; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Sensor systems; Sensors; sequential self-assembly; Shape; Shape recognition; solder- and shape-directed self-assembly; Three dimensional; Encapsulation; Autonomous system; Self assembly; Geometrical shape; Gallium arsenides; Measurement sensor; sequential self-assembly; Experimental study; Telemetry; Electrical connection; Liquid metal; Metal coating; sensor systems; Sequential method; Complementary MOS technology; Defect; Heterogeneous integration; Soldering; solder- and shape-directed self-assembly; Microelectromechanical device; Fluidics

The nonrobotic fabrication of packaged microsystems that contain nonidentical parts has been accomplished by a directed self-assembly process. The self-assembly process uses geometrical shape recognition to identify different components and subsequent bond formation between liquid solder and metal-c...